Copper Bonded Grounding Rod
Product Code : CBGR
These copper bonded grounding rods are molecularly bonded with pure electrolytic grade copper over a low carbon tensile steel rod with the thickness of 254 micron copper coating. We are also able to deliver customized copper thickness between 100 microns to 330 microns. All the raw materials used in the Composition strictly comply with the certified standards.
B-140, Subhash Park Extension, Uttam Nagar, New Delhi, Delhi, 110059, India